AEC Documents

The following documents have been established by the AEC Component Technical Committee to define common electrical component qualification requirements. These documents contain detailed qualification and?requalification?requirements and include unique test methods and guidelines for the use of generic data. Components meeting these specifications are suitable for use in the harsh automotive environment without additional component level qualification testing. Suppliers may advertise components meeting these specifications without restrictions, but the specifications cannot be changed without the approval of the Sustaining Members (currently?Autoliv,?Bose Corporation,?Continental,?Cummins,?Delphi,?Denso International America,?Gentex,?Harman,?Hella,?John Deere Electronic Solutions (Phoenix International),?Lear Corporation,?Magna Electronics,?TRW Automotive,?Valeo, and?Visteon).

Important: To view and download these documents free of charge simply click on the appropriate link.

• AEC - Q100:?Failure Mechanism Based Stress Test Qualification For Integrated Circuits
• AEC - Q100 Rev - H:?Failure Mechanism Based Stress Test Qualification For Integrated Circuits (base document)
• AEC - Q100-001 - Rev-C: Wire Bond Shear Test
• AEC - Q100-002 - Rev-E: Human Body Model (HBM) Electrostatic Discharge Test
• [Decommissioned]?AEC - Q100-003 - Rev-E: Machine Model (MM) Electrostatic Discharge Test
• AEC - Q100-004 - Rev-D: IC Latch-Up Test
• AEC - Q100-005 - Rev-D1: Non-Volatile Memory Program/Erase Endurance, Data Retention, and Operational Life Test




• NOTE (dated August 20, 2013):?The AEC - Q100-005 document was revised to correct errors that occurred during the publication process. The Rev-D1 document is the version approved by the AEC Technical Committee.


• [Decommissioned]?AEC - Q100-006 - Rev-D: Electro-Thermally Induced Parasitic Gate Leakage Test (GL)
• AEC - Q100-007 - Rev-B: Fault Simulation and Test Grading
• AEC - Q100-008 - Rev-A: Early Life Failure Rate (ELFR)
• AEC - Q100-009 - Rev-B: Electrical Distribution Assessment
• AEC - Q100-010 - Rev-A: Solder Ball Shear Test
• AEC - Q100-011 - Rev-C1: Charged Device Model (CDM) Electrostatic Discharge Test?
  
  
  
  • NOTE (dated March 12, 2013):?The AEC - Q100-011 document was revised to correct symbol errors that occurred during the conversion to PDF format. The revision only affects Table 4, Component Classification levels C4B and C6, where the >= symbol was inadvertently replaced with the = symbol. No other modifications have been made to the document.
  
  
• AEC - Q100-012 - Rev-: Short Circuit Reliability Characterization of Smart Power Devices for 12V Systems


• AEC - Q101: Failure Mechanism Based Stress Test Qualification For Discrete Semiconductors




• NOTE (dated August 20, 2013):?The AEC Technical Committee dedicates AEC-Q101 Rev D1 in memory of:

  Ted Krueger? (1955-2013)	Mark Gabrielle? (1957-2013)



• AEC - Q101 Rev - D1: Failure Mechanism Based Stress Test Qualification For Discrete Semiconductors (base document)
• AEC - Q101-001 - Rev-A: Human Body Model (HBM) Electrostatic Discharge Test
• [Decommissioned]?AEC - Q101-002 - Rev-A: Machine Model (MM) Electrostatic Discharge Test
• AEC - Q101-003 - Rev-A: Wire Bond Shear Test
• AEC - Q101-004 - Rev-: Miscellaneous Test Methods
• AEC - Q101-005 - Rev-: Charged Device Model (CDM) Electrostatic Discharge Test
• AEC - Q101-006 - Rev-: Short Circuit Reliability Characterization of Smart Power Devices for 12V Systems


• AEC - Q200: Stress Test Qualification For Passive Components
• AEC - Q200 Rev - D base: Stress Test Qualification For Passive Components (base document)
• AEC - Q200-001 - Rev-B: Flame Retardance Test
• AEC - Q200-002 - Rev-B: Human Body Model (HBM) Electrostatic Discharge Test
• AEC - Q200-003 - Rev-B: Beam Load (Break Strength) Test
• AEC - Q200-004 - Rev-A: Measurement Procedures for Resettable Fuses
• AEC - Q200-005 - Rev-A: Board Flex / Terminal Bond Strength Test